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Bulletin of the American Mathematical Society
Bulletin of the American Mathematical Society
ISSN 1088-9485(e) ISSN 0273-0979(p)

     

Heat conduction for Riemannian foliations

Author(s): Seiki Nishikawa; Mohan Ramachandran; Philippe Tondeur
Journal: Bull. Amer. Math. Soc. 21 (1989), 265-267.
MSC (1985): Primary 58G11; Secondary 57R30
MathSciNet review: 1011764
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References | Similar articles | Additional information

References:

[AT] J. A. Alvarez-López and Ph. Tondeur, Hodge decomposition along the leaves of a Riemannian foliation (to appear).

[C] E. Cartan, Sur des familles remarquables d'hypersurfaces isoparamétriques dans les espaces sphériques, Math. Z. 45 (1939), 335-367. MR 169

[EH] A. El Kacimi et G. Hector, Décomposition de Hodge basique pour un feuilletage riemannien, Ann. Inst. Fourier (Grenoble) 36 (1986), 207-227. MR 865667

[EK] A. El Kacimi, Equation de la chaleur sur les espaces singuliers, C. R. Acad. Sci. Paris t. 303(1986), 243-246. MR 860827

[GR] P. Greiner, An asymptotic expansion for the heat equation, Arch. Rational Mech. Anal. 41 (1971), 163-218. MR 331441

[H] J. Hadamard, Le problème de Cauchy et les équations aux derivées partielles linéaires hyperboliques, Hermann et Cie, Paris, 1932.

[KT] F. W. Kamber and Ph. Tondeur, De Rham-Hodge theory for Riemannian foliations, Math. Ann. 277 (1987), 415-431. MR 891583

[MR] A. N. Milgram and P. C. Rosenbloom, Harmonic forms and heat conduction I: Closed Riemannian manifolds, Proc. Nat. Acad. Sci. 37 (1951), 180-184. MR 42769

[NRT] S. Nishikawa, M. Ramachandran and Ph. Tondeur, The heat equation for Riemannian foliations, Trans. Amer. Math. Soc. (to appear). MR 987165

[R] B. Reinhart, Foliated manifolds with bundle-like metrics, Ann. of Math. (2) 69 (1959), 119-132. MR 107279

[RT] E. A. Ruh and Ph. Tondeur, Almost Lie foliations and the heat equation method, Proc. of the VI Internat. Colloq. on Differential Geometry, Santiago de Compostela (Spain) 1988, Cursos y Congresos 10, Univ. of Santiago de Compostela, 1989, pp. 239-246. MR 1040849


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Additional Information:

DOI: 10.1090/S0273-0979-1989-15826-6
PII: S 0273-0979(1989)15826-6




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